Bosch Plans To Acquire US Chipmaker TSI Semiconductors
Bosch is increasing its semiconductor manufacturing capacity to meet the rising demand for computer chips for electric vehicles. Bosch recently made the announcement that it is purchasing the US chipmaker TSI Semiconductor and investing $1.5 billion in upgrading TSI’s production lines to produce silicon carbide semiconductors to boost the adoption of EVs.
Currently, the company focuses primarily on developing and mass producing chips for use in the mobility, telecommunications, energy, and life sciences sectors on 200-millimeter silicon wafers. As the automotive industry transitions to green zero-emission EVs, Bosch has been hard at work changing its business. To meet the rising demand for EVs and facilitate the transition, Bosch has heavily invested in developing new products like electric drives, powertrains, and charging solutions.
Starting in 2026, silicon carbide-based 200-millimeter wafers will be used to manufacture the first chips in a facility with about 10,000 square meters of clean room space. Bosch has been producing silicon carbide (SiC) chips since 2021 at its Reutlingen location in Germany, so the company knows what it takes to make them.
By the end of 2030, Bosch will have greatly expanded its global offering of SiC chips thanks to its steady semiconductor business expansion. The demand for these unique semiconductors is particularly high due to the global expansion and acceleration of electromobility.
“With the acquisition of TSI Semiconductors, we are establishing manufacturing capacity for SiC chips in an important sales market while also increasing our semiconductor manufacturing, globally. The existing clean-room facilities and expert personnel in Roseville will allow us to manufacture SiC chips for electromobility on an even larger scale,” says Dr. Stefan Hartung, the Bosch board of management chairman.






















